A Comprehensive Comparison of Leetop, Realtime, and AverMedia Carrier Boards for NVIDIA® Jetson Orin™ NX / Orin™ Nano Modules

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January 29, 2024 679

A Comprehensive Comparison of Leetop, Realtime, and AverMedia Carrier Boards for NVIDIA® Jetson Orin™ NX / Orin™ Nano Modules

Introduction

In the rapidly evolving landscape of AI edge computing, several key players are offering carrier boards designed for NVIDIA's Jetson Orin™ NX and Orin™ Nano modules. This blog post provides a comprehensive comparison of carrier boards from AverMedia, Realtime, and Leetop, focusing on the D133, D131, D131L, RTSO-3002, RTSO-3004, RTSO-3006, A603, A607, and A606 models.

Jetson Orin NX Overview:

The Jetson Orin NX, a potent system-on-module for AI edge computing, features a 12-core GPU, 6-core ARM CPU, and advanced AI processing capabilities. The carrier boards from AverMedia, Realtime, and Leetop aim to complement these features, offering robust and flexible platforms for various applications.

Common Features Across Carriers:

Connectivity: USB 3.1, HDMI, Gigabit Ethernet, and more.
PCIe Support: Gen4 for high-speed data transfer.
Expansion Slots: Multiple PCIe slots for customization.
Power Delivery: Robust system to ensure stable Orin™ NX performance.
Camera Interface: Connectors for multiple cameras, suitable for advanced vision applications.

Jetson Orin Nano Overview:

The Jetson Orin Nano, known for its compact and energy-efficient design, features a 12-core GPU, 2-core ARM CPU, and robust AI capabilities. The carrier boards from AverMedia, Realtime, and Leetop are tailored to harness the full potential of this module, offering a balance between size and functionality.

Common Features Across Carriers:

Form Factor: Compact design for space-constrained applications.
I/O Ports: Essential USB, HDMI, and Ethernet for peripheral compatibility.
Power Efficiency: Emphasis on energy efficiency for strict power constraints.
Expansion Possibilities: Despite compact size, boards offer expansion options.

Technical Specifications Comparison

Feature	AverMedia D133	AverMedia D131	AverMedia D131L	Realtime RTSO-3002	Realtime RTSO-3004	Realtime RTSO-3006	Leetop A603	Leetop A607	Leetop A606
NVIDIA GPU SoC Module Compatibility	NVIDIA® Jetson Orin NX/ Orin Nano module	Jetson Orin NX/ Xavier NX/Nano Module	Jetson Orin NX/ Orin Nano	Jetson Orin NX/Orin Nano	Jetson Orin NX/Orin Nano	Jetson Orin NX/Orin Nano	Jetson Orin NX/Orin Nano	Jetson Orin NX/Orin Nano	Jetson Orin NX/Orin Nano
Networking	1 x GbE RJ-45	1x GbE RJ-45 (PoE option)	1 x GbE RJ-45	1 x Gigabit Ethernet (10/100/1000Mbps adaptive; Half-duplex/full-duplex adaptive)	2 x GbE（10/100/1000Mbps Adaptive）	1 x Gigabit Ethernet (10/100/1000Mbps adaptive; Half-duplex/full-duplex adaptive)	1x GigabitEthernet (10/100/1000)	2x Gigabit Ethernet (10/100/1000)	1xGigabitEthernet (10/100/1000)
Wi-Fi	1 x M.2. key E 2230 for wifi	1xM.2. key E 2230 for Wi-Fi (Nano doesn’t support)	1xM.2. key E 2230 for Wi-Fi (AC9260)	1 x M.2 Key E interface;	1 x miniPCle, 1 x M.2 keyE	Wifi 1 x Onboard wifi module	M.2 KEY E PCIE 1x PCIE 2230 SIZ	1x M.2 KEY E Interface	1x M.2 KEY E Interface
Display Output	1 x HDMI output 3840 x 2160 at 60Hz for Orin NX, 30Hz for Orin Nano	1x HDMI 2.0 (3840 x 2160 at 60Hz)	1x HDMI 3840 x 2160 at 60Hz for Orin NX, 3840 x 2160 at 30Hzfor Orin Nano	1 x Mini HDMI 2.0 interface	1 x HDMI 2.1	1 x Micro HDMI interface;	1 x HDMI	1x HDMI	1 x HDMI
Temperature	Operating temperature -40°C ~85°C (TBD) Storage temperature -40°C ~ 85°C Relative humidity 40 °C @ 95%, Non-Condensing	Operating temperature 0°C~70°C Option 0°C~60°C (PSE 802.3 AF) Storage temperature -40°C ~ 85°C Relative humidity 40 °C @ 95%, Non-Condensing	Operating temperature 0°C~70°C Storage temperature -40°C ~ 85°C Relative humidity 40 °C @ 95%, Non-Condensing	-40°C~+85°C	-40~+85℃	-40~+85℃	Environmental Spec Operating Temperature -25℃~65℃ Storage Temperature -20℃ ~ +60℃ Storage Humidity 10%-90% non-condensing	-25 ℃ to +75 ℃	Operating Temperature-20℃-75℃ Storage Temperature-25℃ ~ +75℃ Storage Humidity 10%-90% non-condensing
MIPI Camera Inputs (Internal)	2 x 4 lane MIPI CSI-2, 22 pin FPC 0.5mm Pitch	2x 2 lane MIPI CSI-2, 15 pin FPC 1mm Pitch Connector 1x 4 lane MIPI CSI-2, 36 pin FPC 0.5mm Pitch Connector	2 x 2 lane, 1 x 4 lane MIPI	2 x MIPI interface;	4 x MIPI Camera Port	1 x MIPI CSI Expansion connector	1x CSI CAMERA	120P camera connector	CSI 2 line
USB	1 x USB 2.0 type C for recovery 2 x USB 3.2 Type-A	1 x USB 2.0 Micro-B, 4 x USB 3.2 Gen1	1 x USB 2.0 Micro-B, 4 x USB 3.2 Gen1	2 x USB3.0 Type A interface, supporting usb2.0 and usb3.0 signals; 1 x Micro USB interface, supporting usb host and usb device modes;	2 x USB Type A ports, support USB 2.0, USB 3.0 signals; 2 x USB Type A ports, support only USB 2.0 signals; 1 x Micro USB port, supporting usb host and usb device modes	2 x Usb3.0 Type C ports, support USB 2.0, USB 3.0 signals, provide 3A output current; 2 x Usb2.0 expansion ports, support only USB 2.0 signals, provide 0.5A output current; 1 x Micro USB port, support Debug;	2x USB 3.0 Type A (Integrated USB 2.0) 1x USB 3.0 0.5mm pitch 20P ZIF 1x USB 2.0 Micro-AB	4x USB 3.0 Type A (Integrated USB 2.0), 1x USB 2.0+3.0 Type C	4 x USB3.0 Type-A （Integrated USB2.0） 1 x USB 2.0+3.0 Link TYPE C
Storage	1x M.2. key M 2280 for NVMe	1x M.2. key M 2280 for SSD	1x M.2. key M 2280 for SSD	1 x M.2 key M	M.2 1 x M.2 Key M interface(SSD NVME 2280);	1 x M.2 key M port for NVME SSD storage;	Supports external NVMe	1x M.2 KEY M Interface	1x M.2 KEY E Interface
Expansion Header	20 pins: 2x I2C, 1x UART, 9x GPIOs	40-pin: 1x UART, 2x SPI, 2x 12C, 1x I2S, GPIOs 1xCAN (3-pin terminal block) 1xDip Switch button 1xOOB supported by Allxon	40-pin: 1x UART, 2x SPI, 2x 12C, 1x I2S, 6x GPIOs 1xOOB supported by Allxon	2 x CAN 2.0； 2 x GPI；2 x GPO； 2 x 3.3V function port UART; 1 x Debug; 1 x I2C； 1 x I2S； 1 x SPI；	1 x M.2 Key B interface(4G、5G) 3 x Extended Pin Header interfaces (UART, CAN, SPI, GPIO, etc.)	1 x CAN interface 1 x 3.3V UARTinterface Other interface 1 x High-speed interface, expandable into M.2 Key B interface (expandable 4G,5G)	2x I2C Link (+3.3V I/O) 6xGPIO 1x UART 2x SPI 1x40 Pin GPIO	1 x CAN 2x I2C Link（+3.3V I/O）1X SPI Bus (+3.3V Level), 4x LED STATE 20PIN IO Connector	1 x CAN FD 1x M.2(Type 2280) 40-Pin GPIO Extended ,18-Pin IO Connector
SIM Card	-	-	-	1x Micro SIM	2 x Nano SIM interface		-	-	-
Input Power	3.5mm Screw Terminal; 12V/5A, 9V~24V is recommended.	Voltage DC 9~24V Current DC IN Jack on board: 7A~2.6A ATX 4pin: 7A~2.6A	Voltage DC 9~24V Current DC IN Jack on board: 7A~2.6A ATX 4pin: 7A~2.6A	9~20V	9~20V	9~36V	Wide input 9-20V DC Input @ 7	+12（7A) --+36V(3A) DC Input	+9---+20V DC Input @ 7A
Thermal Solution	Fan solution (optional)	Heat sink with fan(optional)	Fan (optional)	1 x FAN Port	1 x FAN Port	1 x FAN interface;	1x FAN	1 x FAN (5V PWM)	1 x FAN Port
Buttons	Power and Recovery	Power and Recovery	Power and Recovery	Reset Button, Recovery Button	2 x Button(RESET_BUTTON、RECOVERY_BUTTON)	1 x RESET button;1 x RECOVERY button;	-	3 x Button(POWER_BUTTON,RESET_BUTTON、RECOVERY_BUTTON)	-
RTC Battery	Support RTC battery and Battery Life Monitoring by MCU	Support RTC battery and Battery Life Monitoring by MCU	Support RTC battery and Battery Life Monitoring by MCU	Support RTC battery and Battery Life Monitoring by MCU	Support RTC battery and Battery Life Monitoring by MCU	Onboard RTC;	-	RTC Battery Port	RTC Battery Port
PCB/Electronics Mechanical Info	W: 90mm x L: 76mm H:27mm Weight: 70g	113mm(W) x 105 mm(L) x 28.53 mm(H) Weight: 97g	113mm(W) x 105 mm(L) x 28.53 mm(H) Weight: 97g	w: 65mmx l: 87mm H: 26.65mm Weight: 70g	w: 100mmx l: 150mm H: 26mm Weight: 52g	w: 65mmx l: 87mm H: 18mm Weight: 52g	87 x 52（mm） Weight: 0.1kg	115 x 105 mm (LxW)	100 x 80.6 mm
Product Link	Link	Link	Link	Link	Link	-	Link	Link	Link

Conclusion:

The carrier boards from AverMedia, Realtime, and Leetop present a diverse array of options, catering to various needs in the AI edge computing realm. Whether you prioritize high performance, a balanced solution, or a compact setup, these carrier board lineups ensure there's an ideal match for your specific NVIDIA Jetson Orin™ NX or Orin™ Nano-based project. Choose wisely to elevate your AI applications to new heights.

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