A Comprehensive Comparison of Leetop, Realtime, and AverMedia Carrier Boards NVIDIA® Jetson Orin™ AGX Modules

A Comprehensive Comparison of Leetop, Realtime, and AverMedia Carrier Boards NVIDIA® Jetson Orin™ AGX Modules

Introduction

In the burgeoning realm of edge AI computing, the choice of a carrier board can significantly impact the performance, flexibility, and scalability of your project. In this comparative analysis, we scrutinize three distinct offerings from industry-leading providers: Lee Top, Realtime, and AVerMedia. Each carrier board boasts unique features tailored to diverse application requirements, ranging from smart security to autonomous mobile robots (AMRs). Let's delve into a comprehensive comparison to aid in your decision-making process.

 

Technical Specifications Compariso

FeatureLeetop A680Leetop A605Realtime RTSO-2002Realtime RTSO-2005Realtime RTSO-1002AVerMedia D315
NVIDIA GPU SoC Module5x Gigabit Ethernet(10/100/1000) W2 2x2PSEO ptional)
1x10G		NVIDIA Jetson AGX Orin 64GB NVIDIA Jetson AGX Orin 32GBNVIDIA Jetson AGX Orin core moduleAGX OrinAGX Xavier/ AGX Xavier industry AGX Orin/AGX Orin industryNVIDIA® Jetson AGX Orin™ module (32GB or 64GB)
Networking5x Gigabit Ethernet (10×100×1000M)（W2 2×2PSE optional)1*Gigabit Etherne (10/100/1000)
1*10G		5 x Gigabit Ethernet (10/100/1000Mbps adaptive; Half-duplex/full-duplex adaptive)2 x Gigabit Ethernet (10/100/1000Mbps adaptive; Half-duplex/full-duplex adaptive)1 x GbE（10/100/1000 BASE-T）1x GbE RJ-45
1x 10G RJ-45
Wi-Fi1x M.2KEY E1xM.2 KEY E Interface 1 x M.2 key E port 1x M.2 E key
Display Output1x HDMI1*HDMI1 x HDMI 2.0 interface1xHDMI1 x HDMI TYPE A interface1x HDMI output
Temperature-25℃-70℃--20℃~+80℃-40~+85℃-20~+85℃Operating temperature -25°C~85°C
Storage temperature -40°C ~ 85°C
Relative humidity 40 °C @ 95%, Non-Condensing
USB6x USB 3.0 Type A (Integrated USB 2.0) 1x USB2.0+3.2Type C2*USB 3.2 Type A (Integrated USB 2.0)
1*USB 3.2+2.0 Type C		4 x USB 3.0 interface；1 x Micro USB2.0 interface , 2 x CAN2.0 interface2 x USB Type-C interfaces, (P10) support system burning function, provide 5V/1A output power;

2 x USB TYPE A ports, providing 1A output current;

1 x USB 2.0 Micro port used as slave port to connect Xavier's UART2 and UART3(debug port)		2 x USB TYPE A 3.1 ports GEN1, support usb2.0, usb3.1 signals, 1A output current;2 x

USB TYPE A 2.0 ports, support usb2.0 signal, 1A output current;1 x Micro USB 2.0

interface, used as a slave interface;

1 x USB TYPE A 3.1 ports GEN1, support usb2.0, usb3.1 signals, 1A output current;3 x USB TYPE A 2.0 ports, support usb2.0 signal, 1A output current;1 x Micro USB 2.0 interface, used as a slave interface;		1x USB 2.0 Micro-B for recovery
2x USB 2.0 Type-A
2x USB 3.2 Type-A
Camera1xMIPI (MIPI转6xCSI Camera)120P official carrier board camera interface,CSI Camera = Up to 6 cameras (16 via virtual channels**)16
lanes MIPI CSI-2D-PHY 2.1 (up to 40Gbps) |
C-PHY 2.0 (up to 164Gbps),
Up to 6 cameras (16 via virtual
channels**)16 lanes MIPI CSI2D-PHY 2.1 (up to 40Gbps) |
C-PHY 2.0 (up to 164Gbps)		GSML2 camera interface1 x MIMP CSI Camera extension port (6 x 2 LANE/4 x 4 LA4 x MIPI interface（2LANE）GMSL2/FPD-link III/V-by-One® HS (STURDeCAM20 optional)
Storage64GB eMMC 5.164GB eMMC 5.11 x Micro SD card slot1 x MicroSD card slot1 x M.2 KEY M interface1x micro-SD card slot
CAN bus-1x CAN2 x CAN 2.0 interface2 x CAN port2 x CAN1x CAN bus
SIM Card1xSIM_Card-2xMicro SIM1xMicro SIM1 x Micro SIM card slot1x Micro SIM
Thermal Solution1x FAN(12V PWM)1*Fan (12V PWM)1 x FAN1 x fan control port1 x Fan control interfaceFan (optional)
Expansion HeaderMultifunctional port6x GPIO,1x SPI bus,1x power control,1x system control4 x GPI，4 x,1 x MiniPCIe interface, 2 x I2C interface;2 x SPI interface,4 x 3.3V Programmable GPIO,1 x Mini PCIe port,1 x 3.3V I2C port2 x I2C, 1 x SPI, 3 x UART, 1 x I2S, 1 x
USB2.0, 5 x GPIO, 1xPWM, 1 x MCLK,		• 40-pin (UART, SPI, CAN, I2C, I2S, GPIOs )
• 1x M.2 E key (for Wi-Fi 6E)
• 1x M.2 M key (for SSD or AVerMedia capture card: CN311-H,
CN312SW, CN312MW)
• 1x Micro SIM socket
• 1x mPCIe (for 4G LTE module or 5G module via adapter card)
• 1x PCIe x16 (only support x8 PCIe lanes)
• 1x CAN bus with transceiver
• 120-pin (for MIPI SerDes)
• OOB support
Input Power-+12---+36V(150W) DC Input9V --- +20V DC Input @ 8A-+9V~+36VDC input range-+9V---+20V,9V---+20VDC 12~54V
Buttons1x Power key; 1xRecovery key ; 1xReset key;1x Power key; 1xRecovery key ; 1xReset key;1 x Reset button; 1 x Recovery button; 1 x Power button1 x Reset button; 1 x Recovery button; 1 x Power button1 x Reset Button；1 x Recovery ButtonPower and Recovery
RTC Battery-1*2Ping RTC connector1 x RTC interface1 x RTC battery interface1 x RTC battery holderSupport RTC Battery and Battery Life Monitoring by MCU
PCB/Electronics Mechanical Info319.8x197.2x85.4(mm)-8-channel GMSL2 or 2-channe SATA3.0w 150mm, L 105mm, H 29.5mmW 130mm, L 170mm, H 23mm141.5mm (W) x 133.5mm (L) x 29mm (H)
Weight412.2 g--119g160g200g
Product Link----LinkLink

Comparative Analysis:

Lee Top A680 vs. A605:

The A680 offers extensive interfaces and features suitable for high-performance computing and multiple camera inputs, making it ideal for applications like smart security and autonomous robots.
In contrast, the A605 provides basic features in a compact form factor, catering to applications with low power consumption requirements like smart home and retail.

Realtime RTSO Series:

RTSO-2002 offers a balance between connectivity, storage, and expansion options, suitable for cost-effective solutions.
RTSO-2005 enhances connectivity and display options, catering to applications like digital signage and interactive kiosks.
RTSO-1002 is designed for demanding applications requiring high-speed data processing and expansion capabilities, offering flexibility for integrating additional hardware components.

AVerMedia D315:

The D315 emphasizes versatility with a focus on AMR deployments, smart security, and smart inspection, facilitated by its robust connectivity options and support for high-speed data processing.

Conclusion:

Each carrier board presented in this analysis offers distinct advantages suited to different application requirements. The choice ultimately depends on factors such as performance needs, connectivity options, expansion capabilities, and budget constraints. By carefully evaluating these aspects against your project requirements, you can make an informed decision to propel your edge AI computing endeavors forward.

I hope this blog post was helpful. If you have any questions or feedback, please let me know