Nvidia Jetson Orin Nano Developer Kit

SKU

DB-NVID-0168

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₹41,420.00

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Product Description

Transform Visionary AI Concepts Into Reality.

The NVIDIA Jetson Orin Nano Developer Kit sets a new standard for creating entry-level AI-powered robots, smart drones, and intelligent cameras. It also simplifies the process of starting with Jetson Orin Nano series modules. Compact design, lots of connectors and up to 40 TOPS of AI performance make this the perfect developer kit to bring your AI concepts to life. With up to 80X the performance of Jetson Nano™, it can run all modern AI models, including transformer and advanced robotics models.

The developer kit comprises a Jetson Orin Nano 8GB module and a reference carrier board that can accommodate all Orin Nano and Orin NX modules. This provides the ideal platform for prototyping your next-gen edge-AI product. The Jetson Orin Nano 8GB module features an Ampere architecture GPU and a 6-core ARM CPU, enabling multiple concurrent AI application pipelines and high-performance inference. The carrier board boasts a wide array of connectors, including two camera connectors that can handle 2-lane and 4-lane cameras.

Technical Specifications

	Nvidia Jetson Nano 8GB Module
GPU	NVIDIA Ampere architecture with 1024 CUDA cores and 32 tensor cores
CPU	core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3
Memory	8GB 128-bit LPDDR5 68GB/s
Storage	Supports SD card slot and external NVMe
Video Encode	1080p30 supported by 1-2 CPU cores
Video Decode	1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265

	Reference Carrier Board
Camera	2x MIPI CSI-2 22-pin camera connectors
PCIe	M.2 Key M slot with x4 PCIe Gen3 M.2 Key M slot with x2 PCIe Gen3 M.2 Key E slot
Networking	1*Gigabit Ethernet
Display	1x DP 1.2 (+MST) connector
USB	USB Type-A connector: 4x USB 3.2 Gen2 USB Type-C connector for UFP
Other I/Os	40-pin expansion header (UART, SPI, I2S, I2C, GPIO) 12-pin button header 4-pin fan header microSD slot DC power jack
Mechanical	100mm x 79mm x 21mm (Height includes feet, carrier board, module, and thermal solution)