AVerMedia's carrier board D331 equips powerful NVIDIA Jetson T5000™/Jetson T4000™. This efficient system-on-module (SoM) opens new worlds of embedded IoT applications with full analytic capabilities.
D331 is designed for the industry applications with spatial concern and feature a rich assortment of I/O ports for rapid AI-based solution development and seamless deployment as required by demanding business applications.
AVerMedia supports businesses of all sizes and offers customizable BSP services, flexible MoQ, in addition to NVIDIA's JetPack™ SDK.
AVerMedia devices are built with flexibility in mind and are designed for the following verticals.
AMRs: AMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth.
Smart Security: Smart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety.
Smart Inspection: Smart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production.
| Model | D331 |
| NVIDIA Module Compatibility | NVIDIA Jetson T5000™/Jetson T4000™ |
| Networking | 2x GbE RJ-45 (1 × port supports OOB NCSI for optional OOB module) 1x QSFP (4× 10 GbE for JetPack 7.1 / 4 x 25 GbE for JetPack 7.2) 1 x M.2. key E 2230 for Wi-Fi 6 1x M.2 Key B 3042/3052 for 4G/5G |
| SIMSlot | 2 × SIM slots for 4G/5G module; dual SIM capability depends on the installed cellular module |
| Display Output | 2 x HDMI output (3840 x 2160 at 60Hz) |
| Temperature | Operating temperature: -40 to 85°C (carrier board, W/O audio) Operating temperature: -25 to 85°C (carrier board, W/ audio) Storage temperature -40°C ~ 85°C Relative humidity 40 °C @ 95%, Non-Condensing |
| Camera Inputs | 1x 120pin for GMSL camera board |
| USB | 1x USB 3.2 Type-C for BSP install 1x USB 3.2 Type-C (usage limitations apply; refer to User Manual for details) 4x USB 3.2 Type-A (5Gbps x2 ; 10Gbps x2) Optional 8x USB3.2 Type-A (via daughter board) |
| Audio | 2x 3.5mm phone jack for Mic in & line out. |
| Storage | 2x NVMe M.2 Key M 2280 1x NVMe M.2 Key M 2280 PCIe Gen4 x2 (8xPoE, 8xUSB board, either one) 1x NVMe M.2 Key M 2280 PCIe Gen4 x4 |
| TPM | TI SLB9672XU2.0 on board |
| Expansion | 2x10 Euro Terminal Block 1x CAN-FD (Isolated 3KV), 3x CAN-FD with Transceiver, +5V output 1A, +3.3V output 1A,UART, I2C 20pin expansion header-1: 1x5V(Maximum 1A), 1x3.3V(Maximum 1A) power Output, UARTH1, I2C, GPO(4), GPI(5), PWM(2) 20pin expansion header-2: 1x5V(Maximum 1A), 1x3.3V(Maximum 1A) power Output, UARTH2, I2C, GPO(4), GPI(5), PWM(2) 2x 5-pin JTAG connector 1x 40pin coaxial connector for PCIe expansion (daughter board 8xPSE/8xUSB ) |
| GPS | 1x mPCIe for Optional Dual-RTK GNSS support (via daughter board) |
| Sensor | Temperature sensor for PCB top/bot Temperature measure |
| Power requirement | Terminal block 3Pin & Mini-fit 6pin (Internal) 9~36V DC Input ACC IN / IGN Control (ACC optional, via switch) |
| Thermal Solution | 1x SOM FAN 2x Chassis Fan (12V fan wafer) |
| Buttons | Power and Recovery |
| LED | 1x system power 1x input power |
| MISC | 1x Mini-fit 4Pin DC output for PSE expansion (Pass-through 10A) 1x DC output wafer (9~12V) for GMSL 1x USB-C for Debug_UART (Share with OOB) DIP Switch for function control , AT/ATX Mode select, ACC Enable / Ignore ACC for Development (default) |
| RTC Battery | Support RTC battery and battery life monitoring by MCU |
| PCB/Electronics Mechanical Info | W: 190mm x L: 190mm Weight: 250g |
| Certifications | CE, FCC, VCCI, KC (TBD) |
| Package | 1x Carrier board 2x IO Board 1x Power Adapter (without Power cord) Screws Nuts |