AverMedia D115OXB Embedded System with Orin NX 8GB Module

AverMedia D115OXB Embedded System with Orin NX 8GB Module

Avermedia Engineering Kit D315AO-1 Built with NVIDIA® Jetson AGX Orin Industrial Module

Avermedia Engineering Kit D315AO-1 Built with NVIDIA® Jetson AGX Orin Industrial Module

AVerMedia D317 Carrier Board for NVIDIA® Jetson AGX Orin/AGX Orin Industrial Module

SKU
TEMP-ACC-0699
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₹60,199.00 ₹71,034.82
In Stock
Topic: Topic

Product Description 

AVerMedia Carrier Board D317 support NVIDIA® Jetson AGX Orin , which brings next-level AI performance and power-efficient capability for all autonomous machines. This optional SoM makes advanced analytics possible while providing the ability to handle a host of other embedded IoT applications.

 

D317 includes a 120-pin high-speed connector for connecting MIPI SerDes cameras, which can fulfill the demand for AMRs. In addition, a sufficient Ethernet bandwidth with 10G is excellent for applying smart security, enabling dozens of IP cameras to stream simultaneously. The connector for the 10GigE Vision Camera is also great for smart inspection. Lastly, with its compact size, D315 5G furnishes a PCIe slot for multi-function expansion and excellent compatibility with 5G and Wi-Fi 6.

Key Industries

AVerMedia devices are built with flexibility in mind and are designed for the following verticals.

 

 

AMRsSmart SecuritySmart Inspection
AMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth.Smart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety.Smart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production.

 

Technical Specifications

Model

D317

NVIDIA GPU SoC Module Compatibility

NVIDIA® Jetson AGX Orin module

Networking

•1x GbE RJ-45

•1 x M.2 key E 2230 for wifi 6

•Optional 2x 10G RJ-45 (via daughter board) (TBD)

•Optional 8x PoE (via daughter board) (TBD)

•Optional 1x M.2 Key B for 5G connection (via 5G、PoE/5G、USB/5G daughter board) (TBD)

Display Output

1 x HDMI output 3840 x 2160 at 60Hz


Temperature

•Operating temperature: -40 to 85°C (carrier board), -20 to 70°C (with fan) (TBD)

•Storage temperature -40°C ~ 85°C  (TBD)

•Relative humidity 40 °C @ 95%, Non-Condensing

Camera Inputs

1x 120pin for GMSL camera board

USB

•1x USB 3.2 Type-C for BSP install 

(supports OTG mode,when using with PoE/5G daughter board or USB/5G daughter board, 

the USB 3.2 OTG port becomes USB 2.0)

•1x USB 3.2 Type-C (host mode only)

•Optional 8x USB3.2 Type-A (via daughter board) (TBD)

Storage

2x NVMe M.2 Key M 2280 (1x only support S1 Type Top side component SSD)

TPM 

(Trusted Platform Module)

•Built in Infineon SLB 9672 TPM Chip

 

 

 

Expansion Header

•30pin header: 1xUART, 1xI2C, 3xGPIO,1xSPI, 2xCAN BUS, 1xI2S, 5V(Maximum 0.7A), 3.3V(Maximum 0.7A)

•12pin header: 1x12V(Maximum 0.7A), 1x5V(Maximum 1A), 1x3.3V(Maximum 1A) power Output, 1xUSB 2.0, 1xDMIC

•16pin wafer for OOB or External Button:

       -OOB: 1xUART, 1xDebug UART, 1xPower button, 1xReset button,

       1x Power detect (via out-of-band management module)

       -External Buttons: 1xPower Button, 1xReset button, 1xRecovery button,

       1xPWR_LED (via external button cable)

•40pin coaxial connector for 10G expansion

•40pin coaxial connector for PCIe expansion

GPS

Optional Dual-RTK GNSS support (via daughter board)

Sensor

Temperature sensor for PCB top/bot Temperature measure

Power requirement

Mini-Fit 4pin compatible ,12V +/- 5% DC Input

Thermal Solution

Fan solution (12V fan wafer)

Buttons

Power and Recovery

 

LED

1x system power
1x input power

RTC Battery

Support RTC battery and battery life monitoring by MCU

PCB/Electronics Mechanical Info

•W: 92mm x L: 107mm (TBD)

•Weight: 150g (TBD)

Certifications

CE, FCC, VCCI,KC

Package

1x Carrier board

Screws

Nuts

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