AverMedia D115OXB Embedded System with Orin NX 8GB Module

AverMedia D115OXB Embedded System with Orin NX 8GB Module

Avermedia D315AO-1 5G System with NVIDIA® Jetson AGX Orin ( 32GB/64GB ) & AGX Orin Industrial Module

SKU
TEMP-ACC-0714
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₹247,599.00 ₹292,166.82
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Product Description 

AVerMedia Engineering Kit D315AO-1 built with NVIDIA® Jetson AGX Orin & AGX Orin Industrial module, which brings next-level AI performance and power-efficient capability for all autonomous machines. This optional SoM makes advanced analytics possible while providing the ability to handle a host of other embedded IoT applications.

 

D315AO-1 includes a 120-pin high-speed connector for connecting MIPI SerDes cameras, which can fulfill the demand for AMRs. In addition, a sufficient Ethernet bandwidth with 10G is excellent for applying smart security, enabling dozens of IP cameras to stream simultaneously. The connector for the 10GigE Vision Camera is also great for smart inspection. Lastly, with its compact size, D315AO-1 furnishes a PCIe slot for multi-function expansion and excellent compatibility with 5G and Wi-Fi 6.

Key Industries

AVerMedia devices are built with flexibility in mind and are designed for the following verticals.

AMRs

AMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth.

Smart Security

Smart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety.

Smart Inspection

Smart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production.

 

Technical Specifications

Model

D315AO-1

Type

Engineering Kit

NVIDIA GPU SoC Module Compatibility

NVIDIA® Jetson AGX Orin (32GB / 64GB) & AGX Orin Industrial module

Networking

•1x GbE RJ-45

•1x 10G RJ-45

Display Output

1x HDMI output

 

Temperature

•Operating temperature -25°C~65°C

•Storage temperature -40°C ~ 85°C

•Relative humidity 40 °C @ 95%, Non-Condensing

MIPI Camera Inputs (Internal)

GMSL2/FPD-link III/V-by-One® HS (STURDeCAM20 optional)

 

USB

•1x USB 2.0 Micro-B for recovery

•2x USB 2.0 Type-A

•2x USB 3.2 Type-A

Storage

1x micro-SD card slot

 

 

 

Expansion Header

•40-pin (UART, SPI, CAN, I2C, I2S, GPIOs )

•1x M.2 B key (for 4G LTE module or 5G module)

•1x M.2 E key  (for Wi-Fi 6E)

•1x M.2 M key (for SSD or AVerMedia capture card:  CN311-H, CN312SW, CN312MW)

•1x Micro SIM socket

•1x PCIe x16 (only support x8 PCIe lanes)

•1x CAN bus with transceiver

•120-pin (for MIPI SerDes)

•OOB support (only Power ON/OFF)

 

Power requirement

Voltage DC 12V~54V

Current DC in JACK on board: 7A Max

ATX 4pin: 10.8A Max

Power Cord

US/JP/EU/UK/TW/AU/CN

Thermal Solution

Fan 

Buttons

Power and Recovery

RTC Battery

Support RTC battery and battery life monitoring by MCU

PCB/Electronics Mechanical Info

141.5mm(W) x 133.5mm(L) x 63mm(H)

Weight: 720g

Certifications

CE, FCC, KC

 

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